Logo for Products     Home About Us Products Contact Us Feedback
Products Side Bar
TaoFibre Ceramic Foam Filters
TaoFibre® Ceramic Fiber Board

InterSource offers a family of TaoFibre®high temperature ceramic fiber boards, which are produced through wet forming process of ceramic fiber and binders. TaoFibre®ceramic fiber board is featured with high temperature stability, low thermal conductivity, even density, and excellent resistance against thermal shock and chemical attack. TaoFibre®ceramic fiber board also resists oxidation and reduction. If they are wet by water, steam, or oil, physical and thermal properties are fully restored upon drying. Ceramic Fiber board is used for a variety of high temperature applications, including refractory linings, backup insulation, baffles and muffles, heat shields, combustion chambers, flue insulation, and fire protection. These ceramic fiber boards are available in a variety of temperature ratings, densities, thicknesses, widths and lengths, and custom vacuum formed shapes.

Standard Grade (STD): continuous use up to 1093 C (2000 F)
High- Purity Grade (HP): continuous use up to 1149 C (2100 F)
Zirconium Grade (HZ): continuous use up to 1350 C (2462 F)

Standard Density: 16 pcf (LD), 22 pcf (MO), 26 pcf (HD)
Standard Thickness: 1/4",1/2", 1",1.5", 2"
Standard Widths: 12", 18", 24", 42"
Standard Lengths: 18", 24", 48"

Product Range
Temp. Rating Target Density Board Grade Product Description
2300 F 16-22# STD & HP A high quality surface finish and precise dimensional tolerances make aesthetic quality as well as performance is required.
2300 F

2600 F
23-26#

22-26#
STD

HZ
The addition of clay gives a higher density, MOR, and strength.
Made from a secial blend of alumina-silica fibers and Mullite fiber, the boards give high stability at heat up to 2462 F

  Typical Applications Of Ceramic Fiber Board
  • Insulating backup to brick & castable
  • Furnace hot face lining
  • Use in industrial heat process equipment
  • High temperature gasket & seals
  • Flue & chimney linings in furnace & kilns
  • Molten metal trough covers
  • Expansion joint
  • Industrial heat shields & thermal barriers
  • Industrial combustion chamber construction
  • Infra red element supports
  • Board over blanket hot face lining
  • Full thickness refractory lining
  • High temperature boiler wall insulation
  • Pouring gorms for castable
  •   Typical Product Properties Of Ceramic Fiber Board
    INDEX STD GRADE HP GRADE HZ GRADE
    Temperature 2300 F 2300 F 2600 F
    Working Temp. 200 F 2100 F 2462 F
    Melting Point 3200 F 3200 F 3300 F
    Color cream cream cream
    Available Density (Kg/m3)
    (lbs/ft3)
    260-420
    16(LD)-26(HD)
    260-420
    16(LD)-26(HD)
    260-420
    16(LD)-26(HD)
    LOI (% by Wt) 6-7 % 6-7% 4-6 %
    Dielectric Strength 25.4 volts/mil 25.4 volts/mil 25.4 volts/mil
    Shrinkage (%) 24 Hrsat
    temp. F
    -3
    (1832 F)
    -3
    (2012 F)
    -3
    (2462 F)
    Thermal Conductivity(W/m k)
    for density of 285 kg./m3
    (18 lbs /ft3)
    0.085 (752 F)
    0.132 (1472 F)
    0.180 (1832 F)
    0.085 (752 F)
    0.132 (1472 F)
    0.180 (1832 F)
    0.085 (752 F)
    0.132 (1472 F)
    0.180 (1832 F)
    Tensile 0.5 0.5 0.5
      Typical Chemical Analysis Of Ceramic Fiber Board
    Al2O3 46 47-49 39-40
    SiO2 51 50-52 42-45
    ZrO2 -- -- 15-17
    Fe2O3 <1 0.2 0.2
    Na2O+K2O <0.5 0.2 0.2
    Sizes Available
    Thickness
    24"X36"; 24X48"
    1/2", 1", 1.5", 2"
    24"X36"; 24X48"
    1/4", 1/2", 1", 1.5", 2"
    24"X36"; 24X48"
    1", 1.5", 2"
    Data are average results of tests conducted under standard procedures and are subject to variation. Results should not be used for specification purposes.
    Note: A material safety data sheet is available upon request.
    The information, recommendations and opinions set forth herein are offered solely for your consideration, inquiry and verification, and are not, in part or total, to be construed as constituting a warranty or representation for which we assume legal responsibility. Nothing contained herein is to be interpreted as authorization to practice patented invention without a license.
    1 1